| 摘要 |
<p>The present invention relates to a resin molding apparatus capable of adjusting a flatness, and more particularly, to an resin molding apparatus capable of adjusting a flatness, when a flatness control is required for an upper part, a control screw coupled to a fixing screw by teeth of the screw is rotated by a servo motor to prevent a backlash by an elasticity of a pressing spring while precisely adjusting the flatness of the upper part to prevent a defect of an electronic component, which is molded, and the flatness of the upper part is measured in advance before molding the electronic component so that the flatness of the upper part can be measured and adjusted before molding the electronic component. To this end, the resin molding apparatus capable of adjusting a flatness includes: a body; a lower part able to move up and down; an upper part facing and disposed near the lower part to seal an electronic component when the lower part moves up so that molding to the electronic component is performed; a molding part including an elevating member to move the lower part up and down; an adjusting device rotatably provided on the molding part to adjust a flatness of the lower part or the upper part by a rotation; and a control device to control the adjusting device by selecting any one of a flatness of the molding part before the electronic component is molded and a flatness of the electronic component after the molding of the electronic component is completed so that the flatness of the molding part is adjusted.</p> |
