发明名称 |
Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle |
摘要 |
A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer. |
申请公布号 |
US8988855(B2) |
申请公布日期 |
2015.03.24 |
申请号 |
US201113287253 |
申请日期 |
2011.11.02 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Sakurada Kiyoyasu;Zenzai Kota;Omori Hisayoshi;Kanayama Takashi;Otani Shinji;Shimizu Naoki;Katsuta Seiji |
分类号 |
H01G4/228;H01G4/008;H01G4/06;H01G4/232;H01G4/30;H01G4/12 |
主分类号 |
H01G4/228 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A method for producing a ceramic electronic component, the method comprising:
a step of forming an electrode layer on a surface of a ceramic body, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component; a step of heating the electrode layer in an atmosphere whose oxygen concentration is about 100 ppm or less to form a first conductive layer including an alloy particle that contains the first metal component and the second metal component and protrudes from a surface of the first conductive layer; and a step of forming a second conductive layer on the first conductive layer by plating; wherein a content of the resin in the first conductive layer after heating is about 46% by volume to about 77% by volume. |
地址 |
Kyoto JP |