发明名称 Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle
摘要 A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.
申请公布号 US8988855(B2) 申请公布日期 2015.03.24
申请号 US201113287253 申请日期 2011.11.02
申请人 Murata Manufacturing Co., Ltd. 发明人 Sakurada Kiyoyasu;Zenzai Kota;Omori Hisayoshi;Kanayama Takashi;Otani Shinji;Shimizu Naoki;Katsuta Seiji
分类号 H01G4/228;H01G4/008;H01G4/06;H01G4/232;H01G4/30;H01G4/12 主分类号 H01G4/228
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A method for producing a ceramic electronic component, the method comprising: a step of forming an electrode layer on a surface of a ceramic body, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component; a step of heating the electrode layer in an atmosphere whose oxygen concentration is about 100 ppm or less to form a first conductive layer including an alloy particle that contains the first metal component and the second metal component and protrudes from a surface of the first conductive layer; and a step of forming a second conductive layer on the first conductive layer by plating; wherein a content of the resin in the first conductive layer after heating is about 46% by volume to about 77% by volume.
地址 Kyoto JP