| 发明名称 | Semiconductor package and method for manufacturing the same | ||
| 摘要 | A semiconductor package includes a semiconductor device and a substrate, the semiconductor device including a straight line portion on an outer periphery and the substrate supporting the semiconductor device. A foil positioning pattern is formed on a front surface of the substrate, the positioning pattern touching the straight line portion of the semiconductor device to regulate a position of the semiconductor device. | ||
| 申请公布号 | US8987905(B2) | 申请公布日期 | 2015.03.24 |
| 申请号 | US201213712092 | 申请日期 | 2012.12.12 |
| 申请人 | Mitutoyo Corporation | 发明人 | Yaku Toru;Mizuno Ken |
| 分类号 | H01L23/48;H01L23/52;H01L29/40;H01L23/544;H01L23/498;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Greenblum & Bernstein, P.L.C. | 代理人 | Greenblum & Bernstein, P.L.C. |
| 主权项 | 1. A semiconductor package comprising: a semiconductor having a straight line segment on an outer periphery; a substrate supporting the semiconductor; and a foil positioning pattern located on a front surface of the substrate, the positioning pattern touching the straight line segment of the semiconductor to set a position of the semiconductor; wherein the semiconductor includes, on the straight line segment on the outer periphery, a missing portion having a height from the bottom of the semiconductor that is less than the height of the semiconductor, and the foil positioning pattern having a height from the front surface of the substrate that is greater than the height of the missing portion and that is less than the height of the semiconductor. | ||
| 地址 | Kanagawa JP | ||