Semiconductor package with integrated interference shielding and method of manufacture thereof

摘要

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.

主权项

1. A packaged semiconductor module having an integrated electromagnetic interference shield comprising:
a substrate having a ground plane; an electronic device mounted on a surface of the substrate; a plurality of wirebond springs disposed about the electronic device and electrically coupled to the ground plane, each of the plurality of wirebond springs including a loop of wire having a ball bond disposed on the surface of the substrate, a zone of inflection, a crest, a convex region extending between the zone of inflection and the crest, a sloping tail region having an end coupled to the substrate, and a substantially flat region extending between the crest and the sloping tail region; a mold compound covering the electronic device and at least partially covering the plurality of wirebond springs; and a conductive layer disposed on a top surface of the mold compound and electrically coupled to at least some of the plurality of wirebond springs, the plurality of wirebond springs, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield.