Piezoelectric device and method for manufacturing the same

摘要

A piezoelectric device includes a piezoelectric vibrating piece with a pair of excitation electrodes, a base plate, and a non-conductive bonding material. The base includes a pair of castellations that are hollowed into a side face from the mounting surface to the bonding surface. The pair of castellations include a first surface and a second surface. The first surface extends outward from the mounting surface toward the bonding surface side. The second surface extends outward from the bonding surface toward the mounting surface side. The second surface has a smaller area than an area of the first surface. A wiring electrode is disposed on the first surface, the second surface, and a side face of the bonding material. The wiring electrode is of a same electrode layer as the external electrode. The wiring electrode extends from the external electrode to the extraction electrodes.

主权项

1. A piezoelectric device comprising:
a piezoelectric vibrating piece, including a pair of excitation electrodes and a pair of extraction electrodes, the pair of extraction electrodes being extracted from the pair of excitation electrode; a base plate, including a bonding surface with a pair of external electrodes and a mounting surface, the piezoelectric vibrating piece being disposed on the mounting surface, a pair of castellations being hollowed into a side face from the mounting surface to the bonding surface, the base plate including one of glass and piezoelectric material; a non-conductive bonding material, disposed between the piezoelectric vibrating piece and the base plate, the non-conductive bonding material bonding the piezoelectric vibrating piece and the base plate together, wherein, the pair of castellations include:
a first surface, extending outward from the mounting surface toward the bonding surface side; anda second surface, extending outward from the bonding surface toward the mounting surface side, the second surface having a smaller area than an area of the first surface, anda wiring electrode, disposed on the first surface, the second surface, and a side face of the bonding material, the wiring electrode being of a same electrode layer as the external electrode, the wiring electrode extending from the external electrode to the extraction electrodes.