Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite

摘要

A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.

主权项

1. A porous microneedle array, comprising:
a porous carrier zone formed at a face of a semiconductor substrate; plurality of microneedles disposed on a portion of the porous carrier zone between edge structures disposed on the face of the semiconductor substrate, wherein the edge structures vertically rise to above the plurality of microneedles; and a plastic cap positioned over the plurality of microneedles and covering the plurality of microneedles, wherein the plastic cap includes a surface extending continuously in a plane between flanges that interact with the edge structures for positioning the surface over the plurality of microneedles.