| 主权项 |
1. A test contact arrangement for testing semiconductor components, said test contact comprising:
at least one test contact arranged in a test contact frame, said at least one test contact including a contact arm having a contact tip and being cantilevered from a fastening base, the fastening base including a fastening projection received in a frame opening of the test contact frame in an interference fit, a lower edge of the fastening projection being aligned flush with a lower side of the test contact frame, said fastening projection fixing said at least one test contact relative to said test contact frame, the test contact frame and the test contact being connected to one another via a solder material connection formed on the lower side of the test contact frame, the solder material connection being formed in an electrically conductive manner between at least one contact surface arranged on the lower side of the test contact frame and the lower edge of the fastening projection of the test contact, wherein the at least one contact surface is formed of an electrically conductive contact material applied to the surface of the test contact frame which is formed of an electrically non-conductive material. |
