LED chip with groove and method for manufacturing the same

摘要

An LED chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer. A plurality of grooves are defined through the first semiconductor layer, the light emitting layer and the second semiconductor layer. The light emitting layer is exposed from the grooves. A transparent insulative layer is filled in the grooves. An electrode is further formed on the transparent insulative layer.

主权项

1. An LED (light emitting diode) chip comprising:
a substrate; and an epitaxy structure comprising:
a first semiconductor layer formed on the substrate;a light emitting layer formed on the first semiconductor layer; anda second semiconductor layer formed on the light emitting layer; wherein a plurality of grooves are defined in the epitaxy structure such that the light emitting layer is exposed from the plurality of grooves; and wherein a transparent insulative material is filled in the plurality of grooves; wherein the plurality of grooves comprise a plurality of first grooves and a plurality of second grooves different from the plurality of first grooves, wherein the plurality of second grooves are spaced differently from the plurality of first grooves.