发明名称 Microprocessor image correction and method for the detection of potential defects
摘要 Systems and methods are provided for developing usable chip images in order to detect and screen defects or anomalies in a manufacturing environment. More specifically, a method is provided for manufacturing at least one wafer or chip. The method includes obtaining image data of the at least one wafer or chip. The method further includes correcting the image data to remove normal variation within the image data. The method further includes comparing the corrected image data to image data for at least one other wafer or chip to determine whether the corrected image data for the at least one wafer or chip shows a defect or anomaly beyond that of the normal variation. The method further includes placing the at least one wafer or chip into a category of fabrication based on the comparison.
申请公布号 US8987010(B1) 申请公布日期 2015.03.24
申请号 US201314013067 申请日期 2013.08.29
申请人 International Business Machines Corporation 发明人 Ayotte Stephen P.;Clore Nicholas G.;Norfleet Andrew H.;Yanofsky Jared P.
分类号 H01L21/00;H01L21/66 主分类号 H01L21/00
代理机构 Roberts Mlotkowski Safran & Cole, P.C. 代理人 Strange Michael Le;Roberts Mlotkowski Safran & Cole, P.C.
主权项 1. A method of manufacturing at least one wafer or chip, comprising: obtaining image data of the at least one wafer or chip dynamically during a production wafer test of the at least one wafer or chip; correcting the image data to remove normal variation within the image data wherein correcting the image data comprises: obtaining at least one of test parametric data, test state data, and process data for the at least one wafer or chip;comparing at least one of the test parametric data, the test state data, and the process data to historical data for other wafers or chips already fabricated to determine similar wafers or chips to that of the at least one wafer or chip;generating an image mask based on the historical data for the determined similar wafers or chips; andapplying the image mask to the at least one wafer or chip thereby removing normal variation within the image data; comparing the corrected image data to image data for at least one other wafer or chip to determine whether the corrected image data for the at least one wafer or chip shows a defect or anomaly beyond that of the normal variation; and placing the at least one wafer or chip into a category of fabrication based on the comparison.
地址 Armonk NY US