| 发明名称 |
Warpage control stiffener ring package and fabrication method |
| 摘要 |
A warpage control stiffener ring package includes a substrate having an upper surface and corners. A segmented stiffener ring is formed of “L” shaped segments, each segment being mounted to the upper surface at a corner of the substrate, wherein a gap exists between each of the segments. By forming the segmented stiffener ring of segments having gaps therebetween, warpage of the segmented stiffener ring itself, and thus the thermal stress applied by the segmented stiffener ring on to the substrate, is reduced as compared to a continuous stiffener ring. This allows the segmented stiffener ring to be designed to minimize warpage of the warpage control stiffener ring package. |
| 申请公布号 |
US8986806(B1) |
申请公布日期 |
2015.03.24 |
| 申请号 |
US201213452006 |
申请日期 |
2012.04.20 |
| 申请人 |
|
发明人 |
Baloglu Bora;Watson Jeff |
| 分类号 |
H01L21/00;H01L23/10;H01L23/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
McAndrews, Held & Malloy, Ltd. |
代理人 |
McAndrews, Held & Malloy, Ltd. |
| 主权项 |
1. A structure comprising:
a substrate comprising:
a rectangular upper surface; andcorners; a uniform thickness segmented stiffener ring comprising a plurality of segments, each segment of the plurality of segments coupled to the upper surface of the substrate at a respective corner of the substrate, wherein a gap exists between each segment of the plurality of segments. |
| 地址 |
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