发明名称 Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording medium
摘要 A method of manufacturing a semiconductor device, includes: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: supplying a raw material gas to a substrate in a process chamber, exhausting the raw material gas remaining in the process chamber through an exhaust line, supplying an amine-based gas; and exhausting the amine-based gas through the exhaust line with the supply of the amine-based gas stopped. A degree of valve opening of an exhaust valve disposed in the exhaust line is changed in multiple steps in the process of exhausting the amine-based gas.
申请公布号 US8987146(B2) 申请公布日期 2015.03.24
申请号 US201313788122 申请日期 2013.03.07
申请人 Hitachi Kokusai Electric Inc. 发明人 Kirikihira Kaori;Orihashi Yugo;Shimamoto Satoshi
分类号 H01L21/31;H01L21/02;H01L21/67;C23C16/30;C23C16/44;C23C16/455;C23C16/52 主分类号 H01L21/31
代理机构 Volpe and Koenig, P.C. 代理人 Volpe and Koenig, P.C.
主权项 1. A method of manufacturing a semiconductor device, comprising: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle comprising: supplying a raw material gas to a substrate in a process chamber; exhausting the raw material gas remaining in the process chamber through an exhaust line in a state where the supply of the raw material gas is being stopped; supplying an amine-based gas to the substrate in the process chamber; and exhausting the amine-based gas remaining in the process chamber through the exhaust line in a state where the supply of the amine-based gas is being stopped, wherein a degree of valve opening of an exhaust valve disposed in the exhaust line is changed in multiple steps in the act of exhausting the amine-based gas remaining in the process chamber.
地址 Tokyo JP