Oscillator device and manufacturing process of the same

摘要

An oscillator device includes: a structural layer extending over a first side of a semiconductor substrate; a semiconductor cap set on the structural layer; a coupling region extending between and hermetically sealing the structural layer and the cap and forming a cavity within the oscillator device; first and second conductive paths extending between the substrate and the structural layer; first and second conductive pads housed in the cavity and electrically coupled to first terminal portions of the first and second conductive paths by first and second connection regions, respectively, which extend through and are insulated from the structural layer; a piezoelectric resonator having first and second ends electrically coupled, respectively, to the first and second conductive pads, and extending in the cavity; and third and fourth conductive pads positioned outside the cavity and electrically coupled to second terminal portions of the first and second conductive paths.

主权项

1. An oscillator device, comprising:
a substrate of semiconductor material, having a first side and a second side; a structural layer extending above the first side of the substrate; a cap of semiconductor material arranged on the structural layer; a coupling region, extending between the structural layer and the cap, configured to hermetically seal the cap to the structural layer and form a cavity within the oscillator device; a first conductive path and a second conductive path, which extend between the substrate and the structural layer, the first and second conductive paths each including a first terminal portion and a second terminal portion; a first conductive pad and a second conductive pad housed in said cavity; first and second connection regions extending through the structural layer and electrically insulated from the structural layer, the first and second connection regions respectively electrically coupling the first and second conductive pads to the respective first terminal portions of the first and second conductive paths; a piezoelectric resonator, having a first end and a second end electrically coupled, respectively, to the first and second conductive pads, and extending in said cavity; and a third conductive pad and a fourth conductive pad positioned outside said cavity and electrically coupled respectively to the respective second terminal portions of the first and second conductive paths, wherein the structural layer is of a conductive material and the first and second connection regions are first and second conductive of the conductive material of the structural layer, the oscillator device further comprising first and second insulating trenches completely surrounding the first and second conductive pillars, respectively, and respectively insulating the first and second conductive pillars from the structural layer.