发明名称 Device for coating substrates disposed on a susceptor
摘要 The invention relates to a device for coating substrates having a process chamber (1) disposed in a reactor housing and a two-part, substantially cup-shaped susceptor (2, 3) disposed therein, forming an upper susceptor part (2) with the cup floor thereof having a flat plate (2′) and a lower susceptor part (3) with the cup side walls thereof, the outer side (4) of the plate (2′) of the upper susceptor part (2) facing upwards toward the process chamber (1) and forming a contact surface for at least one substrate, the upper susceptor part (2) contacting a front edge (3″) of the lower susceptor part (3) at the edge of said upper susceptor part (2), the lower susceptor part (3) being supported by a susceptor carrier (6), and heating zones (A, B, C) for heating the upper susceptor part (2) being disposed below the plate (2′). An advantageous refinement of the invention proposes that the upper susceptor part (2) be removable from the process chamber (1) separately from the lower susceptor part (3), and the joint (30) between the edge of the upper susceptor part (2) and the front edge (3″) of the lower susceptor part (3) be formed as a heat conduction barrier.
申请公布号 US8986453(B2) 申请公布日期 2015.03.24
申请号 US200812664648 申请日期 2008.06.13
申请人 Aixtron Inc. 发明人 Käppeler Johannes;Boyd Adam;Saywell Victor;Mulder Jan;Feron Olivier
分类号 B05C11/00;C23C16/458;C23C16/46;C30B25/12;H01L21/687 主分类号 B05C11/00
代理机构 Ascenda Law Group, PC 代理人 Ascenda Law Group, PC
主权项 1. A device for coating substrates, having a process chamber (1) which is disposed in a reactor housing and a two-part, substantially cup-shaped susceptor (2, 3) which is disposed in said process chamber, an upper part (2) of the susceptor being formed by a flat plate (2′), and a lower part (3) of the susceptor being formed by an annular or tubular structure, the outer side (4) of the flat plate (2′) of the susceptor upper part (2) facing upward toward the process chamber (1) and forming a bearing surface for at least one substrate, the susceptor upper part (2), by way of its edge, resting on an end edge (3″) of the susceptor lower part (3), the susceptor lower part (3) being supported by a tubular susceptor carrier (6), and a heater (9) with heating zones (A, B, C) for heating the susceptor upper part (2) being disposed beneath the flat plate (2′), the device characterized in that the susceptor upper part (2) can be removed from the process chamber (1) separately from the susceptor lower part (3), and a joint (30) between the edge of the susceptor upper part (2) and the end edge (3″) of the susceptor lower part (3) forms a barrier to a conduction of heat from the susceptor upper part (2) to the susceptor lower part (3), wherein the heater (9) is disposed within a cavity of the cup-shaped susceptor (2, 3), the cavity being adjacent to the flat plate (2′).
地址 Sunnyvale CA US