发明名称 Fracture prediction method, device, a program arrangement and computer-accessible medium therefor
摘要 According to exemplary embodiments of the present invention, using a fracture limit stress line obtained by converting a hole expansion ratio into a stress as a criterion for a fracture, the risk of fracture in a material can be evaluated quantitatively by comparing the relationship between data obtained from a numerical analysis using a finite element method and the fracture limit stress line. Thus, when determining a fracture limit in a stretch flange portion in a thin plate in a process including one or more deformation path variations, it is possible to obtain the fracture limit curve easily and efficiently and predict the fracture with high accuracy, and the risk of fracture upon press forming or crash can be evaluated.
申请公布号 US8990028(B2) 申请公布日期 2015.03.24
申请号 US200712278117 申请日期 2007.02.01
申请人 Nippon Steel & Sumitomo Metal Corporation 发明人 Yonemura Shigeru;Uenishi Akihiro;Hiwatashi Shunji;Yoshida Hiroshi;Yoshida Tohru
分类号 G01L1/00;G01N3/00;G06F17/50 主分类号 G01L1/00
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. A non-transitory computer-accessible medium having instructions thereon for evaluating a particular fracture limit and a fracture likelihood of a thin plate which is a solid thin plate that includes a metal material, wherein when a hardware processing arrangement executes the instructions, the hardware processing arrangement is configured to perform procedures comprising: convert a first fracture limit curve which changes depending on a deformation path in a forming limit diagram of strain space obtained by an estimating unit into a single second fracture limit curve in a stress space when performing a particular procedure of predicting a fracture occurrence in the solid thin plate in a plastic deformation process according to at least one deformation path variation; predict a presence of a fracture occurrence during the particular procedure using the second fracture limit curve measured at a single reference strain rate which is a quasi-static strain rate, said single reference strain rate which is the quasi-static strain rate being a strain rate in the range of 0.001/s to 1/s, wherein the second fracture limit curve measured at said single reference strain rate indicates a fracture limit of the solid thin plate when the solid thin plate is subjected to the reference strain rate before the solid thin plate is fractured, and wherein the second fracture limit curve measured at said single reference strain rate is used as a fracture limit for fracture determination of the solid thin plate, and wherein a hole expansion ratio is used as a criterion for a fracture and deformation conditions of the solid thin plate evaluated by numerical analysis that employs a dynamic explicit method; and convert a plastic strain of the solid thin plate obtained by the dynamic explicit method, into a stress by a numerical simulation post-processing, and compare said stress with the second fracture limit curve in stress space, to predict whether a fracture would occur in the solid thin plate.
地址 Tokyo JP