| 摘要 |
The present invention relates to a semiconductor package and a manufacturing method thereof and, more particularly, to a package on package (POP) type semiconductor package which is manufactured in wafer or panel scale state and a manufacturing method thereof. The present invention provides the semiconductor package and the manufacturing method thereof, capable of: remarkably reducing the size and thickness thereof in comparison with the existing package by directly performing a series of processes like rewiring and molding on the wafer or in panel scale state excluding a substrate; forming a structure of a through mold via for electrical connection with a top package on a bottom package of a POP semiconductor package to change the electrical connection position with the top package by using a rewiring patterning process; and improving the structure with a fine pitch at the same time. |
