发明名称 |
Metal barrier-doped metal contact layer |
摘要 |
A photovoltaic device can include an intrinsic metal layer adjacent to a semiconductor absorber layer; and a doped metal contact layer adjacent to the intrinsic metal layer, where the doped metal contact layer includes a metal base material and a dopant. |
申请公布号 |
US8987587(B2) |
申请公布日期 |
2015.03.24 |
申请号 |
US201213615128 |
申请日期 |
2012.09.13 |
申请人 |
First Solar, Inc. |
发明人 |
Cheng Long;Gupta Akhlesh;Abken Anke;Buller Benyamin |
分类号 |
H01L31/00;H01L21/00;H01L31/0296;H01L31/18;H01L31/0224;H01L31/073 |
主分类号 |
H01L31/00 |
代理机构 |
Dickstein Shapiro LLP |
代理人 |
Dickstein Shapiro LLP |
主权项 |
1. A method for manufacturing a photovoltaic device, the method comprising:
depositing an intrinsic metal layer on a semiconductor absorber layer; sputtering a doped metal contact layer on the intrinsic metal layer, the doped metal contact layer comprising a metal base material and a dopant material, wherein the metal base material is molybdenum, and wherein the dopant material is copper and the doped metal contact layer comprises a copper concentration of about 0.1% to about 10%; and forming a concentration gradient of the dopant material in the intrinsic metal layer by causing diffusion of at least some of the dopant material from the doped metal contact layer. |
地址 |
Perrysburg OH US |