发明名称 |
Conductive bridge resistive memory device and method of manufacturing the same |
摘要 |
A conductive bridge resistive memory device is provided, comprising a first electrode, a memory layer electrically coupled to the first electrode, an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer, a semiconductor layer disposed between the memory layer and the ion-supplying layer, and a second electrode electrically coupled to the ion-supplying layer. |
申请公布号 |
US8987699(B2) |
申请公布日期 |
2015.03.24 |
申请号 |
US201313871040 |
申请日期 |
2013.04.26 |
申请人 |
Macronix International Co., Ltd. |
发明人 |
Lee Feng-Min;Lin Yu-Yu;Chien Wei-Chih;Chen Wei-Chen;Lee Ming-Hsiu |
分类号 |
H01L29/66;H01L45/00;H01L29/861;E04H17/16 |
主分类号 |
H01L29/66 |
代理机构 |
McClure, Qualey & Rodack, LLP |
代理人 |
McClure, Qualey & Rodack, LLP |
主权项 |
1. A conductive bridge resistive memory device, comprising:
a first electrode; a memory layer electrically coupled to the first electrode; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a semiconductor layer disposed between the memory layer and the ion-supplying layer, wherein the semiconductor layer is a multi-layer comprising a p-type semiconductor layer and an n-type semiconductor layer, and the multi-layer allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. |
地址 |
Hsinchu TW |