Encapsulated electromechanical devices

摘要

Encapsulation is provided to electromechanical devices to protect the devices from such environmental hazards as moisture and mechanical shock. In addition to the encapsulation layer providing protection from environmental hazards, the encapsulation layer is additionally planarized so as to function as a substrate for additional circuit elements formed above the encapsulation layer.

主权项

1. An electromechanical device, comprising:
a substrate; an electromechanical element on the substrate, the electromechanical element comprising a movable reflective layer; a layer encapsulating the electromechanical element, wherein the layer is planarized; and an electronic element on or over the layer on a side of the layer distal to the electromechanical element.