Heat sink apparatus for microelectronic devices

摘要

One embodiment of the present invention is a heat sink apparatus for cooling a semiconductor device includes: (a) a rigid support ring having a top surface and a bottom surface; (b) a thermally conductive bottom sheet having a top and a bottom surface, wherein the top surface of the sheet is attached to the bottom surface of the rigid support ring; and (c) a channel for cooling fluid formed by a volume contained by the rigid support ring, the sheet, and an enclosure; wherein the sheet is held in tension by the rigid support ring, thereby reducing the macroscopic coefficient of thermal expansion (CTE) of the sheet. In use, thermally induced mechanical stress in a semiconductor device attached to the bottom surface of the sheet may be ameliorated by the reduction in macroscopic CTE, thereby increasing reliability of an assembly as it is cycled in temperature during normal operation.

主权项

1. A heat sink apparatus for cooling a microelectronic device comprising:
a closed chamber with a bottom sheet, an intake port and an exhaust port; a fluid channel through said chamber, said channel connecting said intake port to said exhaust port; and two or more hollow cylindrical posts disposed in an array over said bottom sheet; each of said posts having a top end and a bottom end, wherein each bottom end is in thermal contact with said bottom sheet; wherein each of said hollow cylindrical posts is pierced by a first hole through a wall of said cylinder proximal to said top end; and wherein each of said hollow cylindrical posts is pierced by a second hole through the wall of said cylinder proximal to said bottom end.