Hybrid lead frame and ball grid array package

摘要

A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled to the first die, a first packaging material encapsulating the first die and the first bond wire, and a lead frame disposed on the first main surface of the first substrate and in electrical communication with the first bond wire. At least a portion of the lead frame extends outside of the packaging material. A top package includes first and second main surfaces and an electrical contact on the second main surface. The electrical contact is electrically connected to the lead frame and connects the top package to either the first die and/or external circuitry.

主权项

1. A semiconductor device comprising:
a first substrate having opposing first and second main surfaces; a first die disposed on the first main surface of the first substrate; a first bond wire coupled to the first die; a first packaging material encapsulating the first die and the first bond wire; a lead frame disposed on the first main surface of the first substrate and in electrical communication with the first bond wire, at least a portion of the lead frame extending outside of the first packaging material, wherein the lead frame is U-shaped and comprises a first portion lying along the first main surface of the first substrate, an adjacent second portion extending vertically away from the first main surface of the first substrate, and a third portion extending parallel to and spaced from the first main surface of the first substrate; and a top package having first and second main surfaces and an electrical contact on the second main surface, the electrical contact being electrically connected to the third portion of the lead frame.