Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture

摘要

A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT resin material that closes the aperture in the first layer, forming a cavity. The first and second layers are laminated with a thermosetting adhesive that is sufficiently thick to encapsulate particles that may remain from a routing operation for forming the apertures. The interior of the cavity, including exposed portions of the adhesive, and the exposed face of the first layer are coated with an electrically conductive paint. The cap is adhered to a substrate over the MEMS device using an electrically conductive adhesive, which couples the conductive paint layer to a ground plane of the substrate. The layer of conductive paint serves as a shield to prevent or reduce electromagnetic interference acting on the MEMS device.

主权项

1. A device, comprising:
a first layer of polymeric material having a first face and a second face, opposite the first face; an aperture extending through the first layer from the first face to the second face; a second layer of polymeric material positioned on the first face of the first layer and covering the aperture to form a cavity, the cavity having side walls formed by the aperture of the first layer and a back wall formed by a surface of the second layer; a layer of adhesive coupling the first layer and the second layer together, the layer of adhesive having a first thickness; and an electrically continuous layer of conductive paint located in the cavity and extending on the side walls and back wall of the cavity and on the adhesive layer, the layer of conductive paint having a second thickness that is substantially smaller than the first thickness, the layer of conductive paint assisting in adhering the first layer and the second layer together.