| 摘要 |
Embodiments in accordance with the present invention encompass negative-tone, aqueous base developable, self-imagable polymer compositions useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. |
| 主权项 |
1. A method for forming structures disposed on a substrate, comprising:
casting a polymer composition onto the substrate to form a polymer film thereon, where said polymer composition comprising a polymer consisting of a first repeating unit and a second repeating unit represented by formula Ia: where for said first repeating unit at least one of R1, R2, R3 and R4 is —R5COOH and each of the remaining R1, R2, R3 or R4 is hydrogen, and where for said second repeating unit at least one of R1, R2, R3 and R4 is a pendent hydrocarbyl group represented by one of formulae B, C or D: where R5 is a C1 to C6 alkyl moiety or —CH2CH2OCH2— and each of the remaining R1, R2, R3 or R4 is hydrogen; andan optional third repeating unit represented by formula Ia where ate least one of R1, R2, R3 and R4 is selected from epoxyhexylnorbornene, epoxycyclohexanenorbornene, hexylnorbornene, trioxanonanenorbornene, tetraoxadodecanenorbornene, methylglycidylethernorbornene, [(3-ethyl-3-oxetanyl)methoxy]dimethylnorbornenylethylsilane and 5-norbornene-2-yl(methylene)-4,4′-bis-(2,6-di-tert-butylphenol);a photoacid generator; anda casting solvent selected from one or more of propyleneglycol monomethylether, propyleneglycol monomethylether acetate, gamma-butyrolactone, and cyclohexanone; image-wise exposing the polymer film to actinic radiation to form exposed and unexposed patterned portions of the polymer film; first heating the exposed polymer film to a first temperature to initiate a condensation or cross-linking reaction within the exposed portions; removing the unexposed portions by contacting the polymer film with an aqueous base developer solution; and second heating exposed portions to a second temperature, the second heating fixing the exposed patterned portions to the substrate to form structures thereon. |
