| 发明名称 | Printed circuit board structure | ||
| 摘要 | A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions comprises a plurality of empty regions which are spaced from each other. A space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with cooper. | ||
| 申请公布号 | US8987609(B2) | 申请公布日期 | 2015.03.24 |
| 申请号 | US201314066660 | 申请日期 | 2013.10.29 |
| 申请人 | Zhongshan Innocloud Intellectual Property Services Co., Ltd. | 发明人 | Tang Hai-Dong |
| 分类号 | H05K1/00;H05K1/03;H05K1/02 | 主分类号 | H05K1/00 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A printed circuit board (PCB) structure comprising: a base layer; an insulation layer; and a signal layer sandwiched between the base layer and the insulation layer;wherein the signal layer comprises a plurality of conductive regions; the conductive regions are used for providing a current reflowing path; each of the conductive regions comprises a plurality of empty regions spaced from each other; a space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with copper. | ||
| 地址 | Zhongshan CN | ||