Light-emitting device package and method of manufacturing the same

摘要

Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

主权项

1. A method of manufacturing a light-emitting device package, the method comprising:
disposing a pair of lead frames in parallel at both sides of a heat dissipation pad; disposing a light-emitting device on the heat dissipation pad; forming a molding member to surround the heat dissipation pad and the lead frames; and connecting bonding wires between the light-emitting device and the lead frames, wherein: the molding member is formed to surround the entire side of the light-emitting device formed on the heat dissipation pad, and the upper surface of the light-emitting device is exposed to the outside of the molding member at the upper surface of the molding member, the lead frames comprise wire bonding regions connected to the bonding wires, and in the forming of the molding member, the wire bonding regions are exposed to the outside of the molding member at the upper surface of the molding member, and the bottom surfaces of the lead frames are partially exposed to the outside of the molding member at the bottom surface of the molding member.