发明名称 SUBSTRATE TEMPURATURE REGULATING APPARATUS AND SUBSTRATE PROCESSING APPARUTUS USING THE SAME
摘要 Provided is an apparatus for regulating a substrate temperature which can increase the number of degrees of freedom of substrate processing in a chamber by changing the temperature of a substrate for a short time in a chamber of a substrate processing apparatus. The apparatus for regulating a substrate temperature (100) which can change the temperature of a substrate (S) from a first temperature, which is relatively a low temperature, to a second temperature, which is relatively a high temperature, in a chamber of a substrate processing apparatus comprises: a mounting table (10) in which a refrigerant flow path (41) is formed; a substrate elevating unit (20) for lifting and lowering the substrate (S) between a first position on the mounting table (10) and a second position above the mounting table (10); a cooling unit (40) for changing the temperature of the substrate (S) to the first temperature at the first position by supplying a refrigerant to the refrigerant flow path (41); a heating unit (30) for changing the temperature to the second temperature by heating the substrate (S) at the second location by emitting, from the mounting table, the light having an absorbable wavelength to the substrate; and a light transmission window (50) which is installed in the mounting unit (10), transmits the light emitted from the heating unit (30) and guides the light to the substrate (S).
申请公布号 KR20150031182(A) 申请公布日期 2015.03.23
申请号 KR20140118964 申请日期 2014.09.05
申请人 TOKYO ELECTRON LIMITED 发明人 SUZUKI TOMOHIRO;OOYA KAZUHIRO
分类号 H01L21/02;H01L21/324;H01L21/677;H01L21/683 主分类号 H01L21/02
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