CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING BODY

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable circuit board including a conductor portion excellent in adhesiveness to a ceramic substrate, to provide a method of manufacturing a circuit board that allows easily manufacturing such a circuit board, and to provide a highly reliable electronic device, a highly reliable electronic apparatus, and a highly reliable moving body.SOLUTION: A circuit board of the present invention includes a ceramic substrate 210 composed of ceramic and a conductor portion 231 disposed on the ceramic substrate 210. The conductor portion 231 includes a stack of a ground layer 231B containing a group six element and a glass material and a metal layer 231A containing a low-melting metal in this order from the ceramic substrate 210 side. A part of the low-melting metal constituting the metal layer 231A transfers to the ground layer 231B.