| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfill material capable of suppressing the occurrence of voids, and a method for manufacturing a semiconductor device using the same.SOLUTION: An underfill material 20, which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide and has a storage elastic modulus of 3,000 Pa or more when mounted, and has a lowest molten viscosity reach temperature of 125°C or lower, is previously stuck to a semiconductor chip 10 having an electrode with solder formed thereon; the semiconductor chip 10 is mounted on a circuit board 30 having a counter electrode facing the electrode with solder formed thereon; and the semiconductor chip 10 is bonded to the circuit board 30 by heat. |
