| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce manufacturing cost and reduce an encapsulation thickness; and provide a semiconductor module using the semiconductor device and a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises a composite substrate, a chip, an encapsulation layer, a first circuit layer and a second circuit layer. The composite substrate includes: a core plate including a lower opening formed on one surface; a thermal conductive insulation layer which is formed on the other surface of the core plate and has an upper opening opposite to the lower opening, which is formed on a surface on the opposite side to the core plate; and a through hole which pierces the core plate and the thermal conductive insulation layer. The chip is buried in the thermal conductive insulation layer of the composite substrate. The first circuit layer is arranged on a top face which is a surface of the thermal conductive insulation layer, where the upper opening is formed, in the through hole and on a lower surface which is a surface of the core plate, where the lower opening is formed. The second circuit layer is arranged on the lower surface of the core plate and electrically connected with a lower electrode of the chip via the lower opening of the core plate.</p> |
