| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method capable of performing processing to a workpiece with high accuracy in a lump even when a diffraction optical element is used.SOLUTION: A laser processing device comprises: first forming means for forming a shape of a laser beam jetted to a workpiece into a first pattern by using a diffraction optical element; and second forming means for forming the laser beam formed into the first pattern into a second pattern corresponding to a predetermined pattern by using a mask. The workpiece is subjected to collective processing by using the laser beam formed into the second pattern. |
