| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfill material enabling voidless mounting and excellent solder bondability, and a method for manufacturing a semiconductor device using the same.SOLUTION: An underfill material is used which contains an epoxy resin, acid anhydride, an acrylic resin, and an organic peroxide; exhibits non-Bingham fluidity at any temperature of 60°C or more and 100°C or less; has a storage elastic modulus G' in dynamic viscoelasticity measurement having an inflection point in an angular frequency region of 10E+02 rad/s or less; and has the storage elastic modulus G' in the angular frequency of the inflection point or less of 10E+05 Pa or more and 10E+06 Pa or less. Thereby, voidless mounting and excellent solder bondability can be achieved. |
