| 摘要 |
PROBLEM TO BE SOLVED: To reduce the amount of a resin to be a non-product part in a spillover cavity.SOLUTION: A mold device 1 includes a product cavity 30 and a spillover cavity 40 and drives out a part of a molten resin to a spillover cavity by injecting a fluid into the molten resin in a product cavity after ejecting the molten resin into the product cavity to be filled, so as to mold a hollow product in the product cavity. The spillover cavity communicates with a sub-product cavity 50 branched from the spillover cavity, and temperature is adjusted by temperature adjustment means 70 so that the molten resin driven out from the product cavity can reach the sub-product cavity without cooling solidification of the molten resin. |
