| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method or a semiconductor device having a high reliability by suppressing disconnection or peeling of a bonding wire.SOLUTION: A bonding tool includes a terminal 3, a terminal 4, and a bonding wire 5 which includes a connection 11 connected to the terminal 3 and a connection part 12 connected to the terminal 4, for electrically connecting the terminal 3 and the terminal 4. The connection part 11 includes a junction region 31 where a part of the bonding wire 5 is press-fitted, and a junction region 32 where a part of the bonding wire 5 is press-fitted at a position closer to the terminal 12 than to the junction region 31. The thickness of the bonding wire 5 in the junction region 32 is thicker than the thickness of the bonding wire 5 in the junction region 31. |
