发明名称 |
METHOD OF INSPECTING INTEGRATED CIRCUIT DEVICE AND CHECKER |
摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method and a checker capable of inspecting an integrated circuit device having plural conductive members laminated thereon.SOLUTION: The inspection method is a method of inspecting an integrated circuit device in which plural conductive members are laminated thereon. The inspection method includes: a step in which the conductive member is ground while detecting an electrical potential of the first conductive member; a step in which the grinding is terminated based on the detection result; and a step in which a plane exposed by the grinding is inspected. |
申请公布号 |
JP2015056520(A) |
申请公布日期 |
2015.03.23 |
申请号 |
JP20130189277 |
申请日期 |
2013.09.12 |
申请人 |
TOSHIBA CORP |
发明人 |
NAKAI TOMOKAZU;IIZUKA KAZUHIRO |
分类号 |
H01L21/66;H01L21/336;H01L21/8247;H01L27/105;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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