发明名称 METHOD OF INSPECTING INTEGRATED CIRCUIT DEVICE AND CHECKER
摘要 PROBLEM TO BE SOLVED: To provide an inspection method and a checker capable of inspecting an integrated circuit device having plural conductive members laminated thereon.SOLUTION: The inspection method is a method of inspecting an integrated circuit device in which plural conductive members are laminated thereon. The inspection method includes: a step in which the conductive member is ground while detecting an electrical potential of the first conductive member; a step in which the grinding is terminated based on the detection result; and a step in which a plane exposed by the grinding is inspected.
申请公布号 JP2015056520(A) 申请公布日期 2015.03.23
申请号 JP20130189277 申请日期 2013.09.12
申请人 TOSHIBA CORP 发明人 NAKAI TOMOKAZU;IIZUKA KAZUHIRO
分类号 H01L21/66;H01L21/336;H01L21/8247;H01L27/105;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/66
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