发明名称 LAMINATED STRUCTURE ASSEMBLY, MOUNTED SUBSTRATE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING LAMINATED STRUCTURE ASSEMBLY
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminated structure assembly capable of reliably fixing, for example, a laminated structure having a wiring constituting an element to, for example, a mounting substrate.SOLUTION: The laminated structure assembly includes: a laminated structure 10 having a first wiring 31, isolation layers 21 and 22 and first substrate 11 which are laminated in this order from the bottom; and a second substrate 51 having a second wiring 61 formed thereon. An extending part 22A which is an extending part of the isolation layer 22 and an end part 31A of the first wiring 31 protruding from the side face 10A of the laminated structure 10. The bottom face of the extending part 22A and the second substrate 51 are bonded by a photo-curable adhesive layer 71. The end part 31A of the first wiring 31 and the second wiring 61 are electrically connected to each other via a plated layer 62.</p>
申请公布号 JP2015056429(A) 申请公布日期 2015.03.23
申请号 JP20130187211 申请日期 2013.09.10
申请人 SONY CORP 发明人 TOMOTA KATSUHIRO;HASEGAWA TOSHIAKI;TERAHARA HIROSHI
分类号 H01L21/60;H01L23/12;H05K1/14 主分类号 H01L21/60
代理机构 代理人
主权项
地址