| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an ESD protection circuit capable of improving ESD resistance by reducing a resistance value of a wiring for connecting a ground electrode and a bidirectional diode without increasing a layout area and design man-hours.SOLUTION: An ESD protection circuit applied to a semiconductor integrated circuit in which a semiconductor chip coming with a hard macro is mounted on a package substrate comprises a third ground electrode arranged in a core region of the semiconductor chip so as to be adjacent to a first ground electrode arranged in the core region, and a bidirectional diode arranged in the core region so as to be adjacent to the first ground electrode and the third ground electrode, and connected between the first ground electrode and the third ground electrode. The third ground electrode is connected to the second ground electrode arranged in an internal region of the hard macro via a ground wiring formed in a ground wiring layer of the package substrate.</p> |
