ANNEAL MODULE FOR SEMICONDUCTOR WAFERS

摘要

PROBLEM TO BE SOLVED: To provide an anneal module for annealing semiconductor material wafers and similar substrates, the module reducing particle contamination and oxygen ingress while providing uniform heating including 500°C processes.SOLUTION: The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in a lid over the hot plate causes gas to flow uniformly over a wafer surface. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.