EPOXY RESIN COMPOSITION, ELECTRONIC PART DEVICE AND PRODUCTION METHOD OF ELECTRONIC PART DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition with excellent reliability of electric connection and reduced void when used as a sealing material for an electronic part device; an electronic part device with excellent reliability of electric connection and less void; and a production method of an electronic part device with excellent reliability of electric connection and less void.SOLUTION: An epoxy resin composition contains an epoxy resin, a curing agent, a curing accelerator comprising a tetrakisphenol compound and an imidazole compound, a rubber particle having an average particle diameter of 100 nm or less, and an inorganic filler.