| 摘要 |
PROBLEM TO BE SOLVED: To perform reflow soldering by using laser light and a mask, without causing the problem of burnt circuit board, mounted components, or the like.SOLUTION: Solder bodies consisting of solder balls 11 or cream solders 14 are supplied to multiple electrodes 9 formed on a circuit board 7. The circuit board 7 is brought into a state covered with a metal mask 3 having multiple laser projection holes 12 of smaller diameter than that of the solder body. Subsequently, a linear laser light beam 5 elongated laterally is projected from above the mask 3 to scan along a region including the electrode 9. Consequently, the solder body projected with the laser light beam 5 through the laser projection holes 12 is melted and welded to the electrode 9. |
