| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a die bonder and a method of manufacturing a semiconductor, enabling correction of deviation between a collet and a bonding camera at the time of collet replacement, with no use of a die and a substrate in an article.SOLUTION: When a collet is replaced, under a condition in which a needle pin is fitted to the collet and a condition in which a sheet is pasted to a substrate, the collet fitted with the needle pin is made to press against the sheet pasted on the substrate, so that a dent of the needle pin is formed at a die bonding position. An image of the dent is photographed with a bond camera. A position coordinates of a tip end part of the collet is calculated from a position of the dent by an image processing part. The position coordinates at the tip end part of the collet is position-corrected to be a position coordinates of a predetermined die bonding position, and after that, under a condition in which the needle pin is removed from the collet, bonding is made to the substrate.</p> |
