| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which makes it possible to produce a film with excellent mechanical properties with reduced cost.SOLUTION: The resin composition of the invention includes a polyamide-imide resin and an imidazole compound. In one embodiment, the above imidazole compound has a boiling point of 200°C or more. In one embodiment, the above polyamide-imide resin is obtained by reacting the following (a) and (b-1)-(b-3): in which (a) is a tricarboxylic acid anhydride, (b-1) is 3,3'-dimethylbiphenyl-4,4'-diisocyanate, (b-2) is a polyol with a terminal hydroxyl group modified with a diisocyanate, and (b-3) is an aromatic diisocyanate other than (b-1). |
