发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device of low cost and high voltage withstand capability.SOLUTION: A semiconductor device according to an embodiment comprises: a floating drain region 21 provided in a region between a second semiconductor region 13 and a source region 17; a first gate electrode 26 provided between a drain region 15 and the floating drain region 21 on a first semiconductor region 12; and a second electrode 27 provided between the source region 17 and the floating drain region 21 on the first semiconductor region 12, in which a part of the second semiconductor region 13 overlaps below the first gate electrode 26 via a gate insulation film 25.
申请公布号 JP2015056472(A) 申请公布日期 2015.03.23
申请号 JP20130188165 申请日期 2013.09.11
申请人 TOSHIBA CORP 发明人 TAKADA OSAMU
分类号 H01L21/336;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;H01L29/78 主分类号 H01L21/336
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