| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfill material enabling a wide mounting margin, and a method for manufacturing a semiconductor device using the same.SOLUTION: An underfill material 20 is used which contains an epoxy resin, acid anhydride, an acrylic resin, and an organic peroxide; has a minimum melting viscosity reach temperature of 100°C or more and 150°C or less when a melting viscosity is measured on a temperature rising rate condition of 5°C/min or more and 50°C/min or less; and has a minimum melting viscosity of 100 Pa s or more and 5,000 Pa s or less. Because a change in the minimum melting viscosity reach temperature when measured on different temperature rising conditions is small, even when a temperature profile at the time of thermal compression bonding is not strictly controlled, voidless mounting and excellent solder bondability can be achieved, and a wide mounting margin can be achieved. |
