| 摘要 |
<p>The present invention relates to an apparatus and a method to manufacture a multilayer flexible printed circuit board (FPCB) using a non-contact compression. The multilayer FPCB manufacturing apparatus using a non-contact compression according to the present invention includes a chamber, a plate, a vacuum pad, a vacuum forming unit, a pressing unit, a temperature controlling unit, and a control unit. The present invention forms the inside of the vacuum pad to be in a vacuum state and to be accommodated in the chamber by covering the multilayer FPCB with the vacuum pad after arranging the multilayer FPCB on the plate. The present invention compresses the multilayer FPCB in a non-contact way by forming the chamber to be in a state of high temperature and high pressure. The apparatus and the method to manufacture a multilayer FPCB using a non-contact compression according to the present invention add an even pressure to the multilayer FPCB and are able to prevent bubbles from being generated inside. The present invention is able to improve productivity by compressing various types of substrates at the same time.</p> |
