| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is mounted on a heat sink by using solder achieving low thermal resistance.SOLUTION: A semiconductor package according to one embodiment includes: a base metal part 12; a frame body 13; input/output side wiring lines 15a, 15b; and a lid 14. The base metal part 12 has slits 19 on a rear surface, and a semiconductor chip 11 may be mounted on a surface of the base metal part 12. The frame body 13 is disposed on the surface of the base metal part 12. The input/output side wiring lines 15a, 15b are provided so as to penetrate through a side surface of the frame body 13. The lid 14 is disposed on the frame body 13. |
