| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows improving heat dissipation without an increase in cost and has an electromagnetic shield.SOLUTION: A semiconductor substrate 11 has semiconductor elements 12a and 12b on its first surface and has electrode pads 23 and 24 for inputting and outputting a high-frequency signal to the semiconductor elements 12a and 12b on the first surface. A side-wall portion 29 is provided in a frame shape on the first surface of the semiconductor substrate 11 so as to surround the semiconductor elements 12a and 12b and electrode pads 23 and 24, and has conductivity. A cap substrate 30 is provided on the side-wall portion 29 so as to be electrically connected to the side-wall portion 29. Input and output terminal portions 33 and 34 are provided on a second surface of the semiconductor substrate 11 so as to be electrically connected to the electrode pads 23 and 24. A ground conductor 32 is provided on the entire second surface of the semiconductor substrate 11 except for a region where the input and output terminal portions 33 and 34 are provided, so as to be electrically connected to the side-wall portion 29. |
