摘要 |
<p>The invention relates to a process for manufacturing a composite structure, said process comprising the following steps: a) providing a donor substrate (50) and a carrier substrate (10); b) forming a dielectric layer (30); c) forming a covering layer (20); d) forming a weakened zone (60) in the donor substrate (50); e) joining the carrier substrate (10) and the donor substrate (50) via a contact surface (70) having an outline (Cs); f) fracturing the donor substrate (50) via the weakened zone (60), steps b) and e) being executed so that the outline (Cz) is inscribed in the outline (Cs), and step c) being executed so that the covering layer (20) covers the peripheral surface of the dielectric layer (30).</p> |