| 摘要 |
<p>The present invention provides a method for processing a device wafer which can mount a device wafer to a ring frame with a predetermined orientation even in the case that the device wafer has no notch, orientation flat, etc. The present invention provides a method for processing a device wafer, having a plurality of devices individually formed in a plurality of separate regions on the surface partitioned by a plurality of expected crossing division lines, including a target pattern storing step of imaging the surface of the device wafer to detect and store a target pattern; a protective tape attaching step of attaching a protective tape to the surface of the device wafer after performing the target pattern storing step; a grinding step of holding the surface side of the device wafer through the protective tape after performing the protective tape attaching step and next grinding the back side of the device wafer to thereby reduce the thickness of the device wafer to a predetermined thickness; a positioning step of imaging the surface of the device wafer after performing the grinding step and next positioning the device wafer with respect to a ring frame according to the target pattern stored by performing the target pattern storing step so that the device wafer is oriented to a predetermined direction; and a transfer step of attaching an adhesive tape to the back side of the device wafer after performing the positioning step to thereby mount the device wafer through the adhesive tape to the ring frame and next removing the protective tape from the front side of the device wafer.</p> |
