| 摘要 |
<p>The present invention relates to a semiconductor device which comprises: a plurality of stacked semiconductor chips; a plurality of through electrodes transmitting signals between the semiconductor chips, and arranged to form a plurality of columns and rows; switches connected to at least some of the through electrodes in an one-to-one manner, and switching each of the signals to different through electrodes; and signal ports inputting the signals to the switches or inputted from the switches. At least one signal port simultaneously inputs the signals to two first switches corresponding to two first through electrodes arranged on both sides while putting one through electrode among the through electrodes arranged in a first column inbetween, and to two second switches connected to two second through electrodes, which are arranged in the identical row to the through electrode, among the through electrodes arranged in the first column or a second column neighboring the first column; or is inputted with the signals from either the first switch or the second switch.</p> |
