| 摘要 |
<p>A wafer chuck (1b) having a substrate (2) and having, applied to the substrate (2), an electrically conductive coating (8) for fixing a wafer (6) by electrostatic attraction and preferably having a reflective coating (10) applied to the substrate (2). The coating (8; 10) has at least a first layer (3; 11) under compressive stress and at least a second layer (7; 12) under tensile stress for compensating for the compressive stress of the first layer (3; 11) in order to keep deformation of the wafer chuck (1b) by the coating (8, 10) as low as possible.</p> |
