发明名称 |
Method for Implementing High-Precision Backdrilling Stub Length Control |
摘要 |
The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth. |
申请公布号 |
US2015078848(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201414553942 |
申请日期 |
2014.11.25 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
Yang Yongxing;Zhang Jian;Liu Shandang |
分类号 |
H05K3/42;B23B49/00;B23B41/00 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
1. A printed circuit board drilling method comprising:
controlling, by a drill, a drill bit to perform a drilling motion from an initial location; generating, by the drill, a first electrical signal when the drill bit comes into contact with a first conductive layer of a printed circuit board; determining a first conductive location according to the first electrical signal; obtaining a first Z-coordinate information corresponding to the first conductive location; continuing to control the drill bit to perform the drilling motion after drilling through the first conductive layer; generating, by the drill, a second electrical signal when the drill bit comes into contact with a second conductive layer of the printed circuit board; determining a second conductive location according to the second electrical signal; obtaining a second Z-coordinate information corresponding to the second conductive location; continuing to control the drill bit to perform the drilling motion until the drill bit drills through the printed circuit board to obtain a through hole; and controlling the drill bit to perform a backdrilling motion in a location of the through hole according to a preset depth, wherein the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth, and wherein the medium thickness is obtained by calculating an absolute value of a difference between the first Z-coordinate information and the second Z-coordinate information. |
地址 |
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