发明名称 Method for Implementing High-Precision Backdrilling Stub Length Control
摘要 The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.
申请公布号 US2015078848(A1) 申请公布日期 2015.03.19
申请号 US201414553942 申请日期 2014.11.25
申请人 HUAWEI TECHNOLOGIES CO., LTD. 发明人 Yang Yongxing;Zhang Jian;Liu Shandang
分类号 H05K3/42;B23B49/00;B23B41/00 主分类号 H05K3/42
代理机构 代理人
主权项 1. A printed circuit board drilling method comprising: controlling, by a drill, a drill bit to perform a drilling motion from an initial location; generating, by the drill, a first electrical signal when the drill bit comes into contact with a first conductive layer of a printed circuit board; determining a first conductive location according to the first electrical signal; obtaining a first Z-coordinate information corresponding to the first conductive location; continuing to control the drill bit to perform the drilling motion after drilling through the first conductive layer; generating, by the drill, a second electrical signal when the drill bit comes into contact with a second conductive layer of the printed circuit board; determining a second conductive location according to the second electrical signal; obtaining a second Z-coordinate information corresponding to the second conductive location; continuing to control the drill bit to perform the drilling motion until the drill bit drills through the printed circuit board to obtain a through hole; and controlling the drill bit to perform a backdrilling motion in a location of the through hole according to a preset depth, wherein the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth, and wherein the medium thickness is obtained by calculating an absolute value of a difference between the first Z-coordinate information and the second Z-coordinate information.
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